{"version":"1.0","type":"rich","provider_name":"techandbusiness.org","provider_url":"https://techandbusiness.org","title":"GlobalFoundries signs $2 billion deal to make TSMC packaging components","author_name":"techandbusiness.org · Infrastructure, Tech & Business","thumbnail_url":"https://cdn.mos.cms.futurecdn.net/3U4RCLfXwdNRTJWLyMCVXX-1600-80.jpg","width":600,"height":400,"html":"<blockquote class=\"tb-newswire-embed\" style=\"max-width:600px;border-left:3px solid #22d3ee;padding:12px 16px;margin:0;font-family:-apple-system,system-ui,sans-serif;background:#09090b;border-radius:0 8px 8px 0;\">\n      <p style=\"margin:0 0 8px;font-size:10px;font-weight:600;letter-spacing:0.1em;color:#71717a;\">techandbusiness.org · Infrastructure, Tech & Business</p>\n      <p style=\"margin:0 0 8px;font-size:18px;font-weight:700;line-height:1.3;color:#fff;\"><a href=\"https://techandbusiness.org/newswire/-jmWCF2oa9qK5isiu3OyiA\" style=\"color:#fff;text-decoration:none;\">GlobalFoundries signs $2 billion deal to make TSMC packaging components</a></p>\n      <p style=\"margin:0;font-size:14px;color:#a1a1aa;line-height:1.5;\">GlobalFoundries and TSMC entered a five-year manufacturing agreement valued at $2 billion for silicon interposers used in TSMC's CoWoS advanced packaging, Tom's Hardware reported. GlobalFoundries will...</p>\n    </blockquote>"}