{"version":"1.0","type":"rich","provider_name":"techandbusiness.org","provider_url":"https://techandbusiness.org","title":"Micron plans external base dies as Samsung weighs TSMC for custom memory","author_name":"techandbusiness.org · Infrastructure","thumbnail_url":"https://d2l930y2yx77uc.cloudfront.net/production/social_images/89fdac34d4bab6d5f37d1ad9f57a4c6103ae93c0.png","width":600,"height":400,"html":"<blockquote class=\"tb-newswire-embed\" style=\"max-width:600px;border-left:3px solid #22d3ee;padding:12px 16px;margin:0;font-family:-apple-system,system-ui,sans-serif;background:#09090b;border-radius:0 8px 8px 0;\">\n      <p style=\"margin:0 0 8px;font-size:10px;font-weight:600;letter-spacing:0.1em;color:#71717a;\">techandbusiness.org · Infrastructure</p>\n      <p style=\"margin:0 0 8px;font-size:18px;font-weight:700;line-height:1.3;color:#fff;\"><a href=\"https://techandbusiness.org/newswire/4cpXHh04O0SOvCDBOdXjHC\" style=\"color:#fff;text-decoration:none;\">Micron plans external base dies as Samsung weighs TSMC for custom memory</a></p>\n      <p style=\"margin:0;font-size:14px;color:#a1a1aa;line-height:1.5;\">Micron plans to use external foundries to manufacture base dies for its NVIDIA-designed NVHBM and standard HBM4E memory, according to The Elec reporting cited by note. Base dies connect stacked memory...</p>\n    </blockquote>"}