{"version":"1.0","type":"rich","provider_name":"Tech & Business","provider_url":"https://techandbusiness.org","title":"TSMC's CoWoS advanced chip packaging revenue grows at 80% CAGR as Nvidia reserves capacity","author_name":"T&B Newswire · Infrastructure","thumbnail_url":"https://techandbusiness.org/api/og/newswire/a0FPCi5tjsU2FdkevkPf88","thumbnail_width":1200,"thumbnail_height":630,"width":600,"height":400,"html":"<blockquote class=\"tb-newswire-embed\" style=\"max-width:600px;border-left:3px solid #22d3ee;padding:12px 16px;margin:0;font-family:-apple-system,system-ui,sans-serif;background:#09090b;border-radius:0 8px 8px 0;\">\n      <p style=\"margin:0 0 8px;font-size:10px;font-weight:600;letter-spacing:0.1em;color:#71717a;text-transform:uppercase;\">T&B NEWSWIRE · Infrastructure</p>\n      <p style=\"margin:0 0 8px;font-size:18px;font-weight:700;line-height:1.3;color:#fff;\"><a href=\"https://techandbusiness.org/newswire/a0FPCi5tjsU2FdkevkPf88\" style=\"color:#fff;text-decoration:none;\">TSMC's CoWoS advanced chip packaging revenue grows at 80% CAGR as Nvidia reserves capacity</a></p>\n      <p style=\"margin:0;font-size:14px;color:#a1a1aa;line-height:1.5;\">Taiwan Semiconductor Manufacturing Company (TSMC) announced that revenue from its most advanced chip packaging technology, CoWoS, is growing at an 80% compound annual growth rate as the company ramps ...</p>\n    </blockquote>"}