{"version":"1.0","type":"rich","provider_name":"Tech & Business","provider_url":"https://techandbusiness.org","title":"Kandou AI Raises $225 Million to Build Copper Chip Interconnects for AI Infrastructure","author_name":"T&B Newswire · Startups","thumbnail_url":"https://img-cdn.tnwcdn.com/image/tnw-blurple?filter_last=1&amp;fit=1280%2C640&amp;url=https%3A%2F%2Fcdn0.tnwcdn.com%2Fwp-content%2Fblogs.dir%2F1%2Ffiles%2F2026%2F03%2Fkandou-ai-225m-copper-interconnect-ai-infrastructure.png&amp;signature=42ac6f3ea2e7d2098f721f89343b8152","width":600,"height":400,"html":"<blockquote class=\"tb-newswire-embed\" style=\"max-width:600px;border-left:3px solid #22d3ee;padding:12px 16px;margin:0;font-family:-apple-system,system-ui,sans-serif;background:#09090b;border-radius:0 8px 8px 0;\">\n      <p style=\"margin:0 0 8px;font-size:10px;font-weight:600;letter-spacing:0.1em;color:#71717a;text-transform:uppercase;\">T&B NEWSWIRE · Startups</p>\n      <p style=\"margin:0 0 8px;font-size:18px;font-weight:700;line-height:1.3;color:#fff;\"><a href=\"https://techandbusiness.org/newswire/newsDraft-hb91-2-92da5ea0\" style=\"color:#fff;text-decoration:none;\">Kandou AI Raises $225 Million to Build Copper Chip Interconnects for AI Infrastructure</a></p>\n      <p style=\"margin:0;font-size:14px;color:#a1a1aa;line-height:1.5;\">Kandou AI, a Swiss semiconductor company specializing in chip-to-chip interconnect technology, has raised $225 million in new funding to advance its bet that copper can outperform optical fiber for AI...</p>\n    </blockquote>"}