{"version":"1.0","type":"rich","provider_name":"techandbusiness.org","provider_url":"https://techandbusiness.org","title":"SK hynix pushes hybrid-bonded HBM beyond HBM4E","author_name":"techandbusiness.org · AI","thumbnail_url":"https://cdn.mos.cms.futurecdn.net/9DnrtFAiRKUUZvGY424ZgZ-2560-80.jpg","width":600,"height":400,"html":"<blockquote class=\"tb-newswire-embed\" style=\"max-width:600px;border-left:3px solid #22d3ee;padding:12px 16px;margin:0;font-family:-apple-system,system-ui,sans-serif;background:#09090b;border-radius:0 8px 8px 0;\">\n      <p style=\"margin:0 0 8px;font-size:10px;font-weight:600;letter-spacing:0.1em;color:#71717a;\">techandbusiness.org · AI</p>\n      <p style=\"margin:0 0 8px;font-size:18px;font-weight:700;line-height:1.3;color:#fff;\"><a href=\"https://techandbusiness.org/newswire/rjr-kquDvv2snloxFs9v52\" style=\"color:#fff;text-decoration:none;\">SK hynix pushes hybrid-bonded HBM beyond HBM4E</a></p>\n      <p style=\"margin:0;font-size:14px;color:#a1a1aa;line-height:1.5;\">SK hynix said at an Aug. 23 Hot Chips presentation that it does not expect hybrid bonding to be ready for HBM4E, leaving HBM5 as its earliest possible use.\n\nThe company said 16-high HBM4 is in custome...</p>\n    </blockquote>"}