{"version":"1.0","type":"rich","provider_name":"techandbusiness.org","provider_url":"https://techandbusiness.org","title":"TSMC works on new advanced chip packaging similar to Intel: report","author_name":"techandbusiness.org · Infrastructure","thumbnail_url":"https://cdn.benzinga.com/cdn-cgi/image/width=1200,height=800,fit=crop/files/images/story/2026/07/31/Hsinchu--Taiwan---Apr-12--2021-Tsmc-Muse.jpg","width":600,"height":400,"html":"<blockquote class=\"tb-newswire-embed\" style=\"max-width:600px;border-left:3px solid #22d3ee;padding:12px 16px;margin:0;font-family:-apple-system,system-ui,sans-serif;background:#09090b;border-radius:0 8px 8px 0;\">\n      <p style=\"margin:0 0 8px;font-size:10px;font-weight:600;letter-spacing:0.1em;color:#71717a;\">techandbusiness.org · Infrastructure</p>\n      <p style=\"margin:0 0 8px;font-size:18px;font-weight:700;line-height:1.3;color:#fff;\"><a href=\"https://techandbusiness.org/newswire/xVtyRF0J4K8XFio1UN6teW\" style=\"color:#fff;text-decoration:none;\">TSMC works on new advanced chip packaging similar to Intel: report</a></p>\n      <p style=\"margin:0;font-size:14px;color:#a1a1aa;line-height:1.5;\">TSMC is developing a chip packaging technology similar to Intel's Embedded Multi-die Interconnect Bridge, internally called \"EMIB Like,\" and is partnering with Taiwan's Kinsus Interconnect Technology ...</p>\n    </blockquote>"}