# Micron plans external base dies as Samsung weighs TSMC for custom memory

_Published Sunday, October 11, 2026 at 3:17 PM EDT · Infrastructure · Latest · Tier 2 — Notable_

![Micron plans external base dies as Samsung weighs TSMC for custom memory — Primary](https://d2l930y2yx77uc.cloudfront.net/production/social_images/89fdac34d4bab6d5f37d1ad9f57a4c6103ae93c0.png)

Micron plans to use external foundries to manufacture base dies for its NVIDIA-designed NVHBM and standard HBM4E memory, according to The Elec reporting cited by note. Base dies connect stacked memory to processors; NVHBM incorporates memory controllers into that component, expanding its role.

The report identifies TSMC as the expected manufacturer for Micron's HBM4E base dies. Separately, ZDNet reported that Samsung is pursuing a strategy combining its memory core dies with base dies from either Samsung Foundry or TSMC, depending on customer requirements.

Samsung's approach remains under review, and the scope of future 3nm adoption, production timing and contract scale still require confirmation.

## Sources

- [note](https://note.com/loyal_myrtle1528/n/nf976632b56cc?hl=en)

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Canonical: https://techandbusiness.org/newswire/4cpXHh04O0SOvCDBOdXjHC
Published: 2026-10-11T19:17:52.606Z
Story chronology: 2026-10-11T06:52:04.000Z
Retrieved: 2026-10-11T21:45:15.367Z
Publisher: Tech & Business (techandbusiness.org)