Airsys launches rack-level liquid cooling system for mid-density AI workloads

Airsys has announced the next generation of LiquidRack, a rack-level liquid cooling platform designed for mid-density AI, data center, telecom, and edge environments. The system integrates fluid distribution, pumping, and control directly at the server level, bridging the gap between air cooling and fully liquid-cooled facilities without requiring separate cooling distribution units. LiquidRack can support up to 8kW per server and up to 80kW per 10U enclosure. Dielectric fluid is sprayed onto vertically-mounted waterproof servers to remove heat. Heated coolant flows back to a plate heat exchanger, dissipating heat into the water circuit, which is then discharged via a dry cooler. Yunshui Chen, founder and CEO of Airsys, said most data center operators need a practical path from air to liquid cooling to meet challenges of high density, stranded power, and environmental goals. He said LiquidRack simplifies deployment and enables customers to scale performance within existing infrastructure constraints. The compressor-free design is compatible with dry coolers, adiabatic, and traditional chiller-based systems. The company says it uses 80 percent less fluid than immersion cooling deployments. Airsys is currently accepting candidates for pilot deployments. The company also launched the UniCool-Max, an air-cooled system delivering up to 60kW of cooling capacity per unit for modular data centers and high-heat equipment environments.