# SK Hynix breaks ground on Indiana high-bandwidth-memory packaging plant

_Thursday, August 27, 2026 at 1:02 PM EDT · Infrastructure · Latest · Tier 2 — Notable_

![SK Hynix breaks ground on Indiana high-bandwidth-memory packaging plant — Primary](https://media.thenextweb.com/2026/08/sk-hynix-indiana-hbm-packaging-europe-lost-wroclaw-plant.jpg)

SK Hynix has broken ground on a more than $4 billion plant in West Lafayette, Indiana, which the article describes as its first US base for high-bandwidth-memory packaging. The 133.5-acre facility is expected to employ about 1,000 people. The company said the cleanroom should open by October 2028 and mass production of next-generation HBM should begin in the second half of 2029. The project remains years from production.

## Sources

- [The Next Web](https://thenextweb.com/news/sk-hynix-indiana-hbm-packaging-europe-lost-wroclaw-plant)

---
Canonical: https://techandbusiness.org/newswire/6GigI6DmaILpzOUwljW5eu
Retrieved: 2026-08-28T01:34:47.185Z
Publisher: Tech & Business (techandbusiness.org)