# Lightspring raises €3.1 million to industrialize photonic-chip packaging

_Published Tuesday, September 22, 2026 at 5:07 AM EDT · Capital, Infrastructure · Latest · Tier 2 — Notable_

![Lightspring raises €3.1 million to industrialize photonic-chip packaging — Primary](https://www.eu-startups.com/wp-content/uploads/2026/09/Untitled-design-2026-09-22T134822.649.jpg)

Lightspring closed a €3.1 million seed round led by Atlantic and OVNI Capital to move its optical-coupling process from the laboratory to a production line. Concept Ventures, Ixcore, Plug and Play Ventures and business angels participated. A €350k grant and other public funding bring its total dilutive and non-dilutive financing to over €3.5 million.

The French startup uses two-photon 3D lithography to fabricate microlenses, waveguides and other coupling structures directly on photonic chips. It targets losses below 0.5 dB per interface without active alignment, compared with the 2-3 dB typical loss the company cites for current methods. Industrial qualification remains ahead.

## Sources

- [EU-Startups](https://www.eu-startups.com/2026/09/besancon-based-lightspring-raises-over-e3-5-million-to-industrialise-photonic-chip-packaging/)

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Canonical: https://techandbusiness.org/newswire/7W-P2b58NFCZC6Yc9j-p00
Published: 2026-09-22T09:07:43.409Z
Story chronology: 2026-09-22T08:21:24.000Z
Retrieved: 2026-09-22T10:31:16.566Z
Publisher: Tech & Business (techandbusiness.org)