# Nvidia, Amkor Ink $1.5-Billion Deal to Expand US Chip Packaging Capacity

_Friday, July 24, 2026 at 8:00 AM EDT · Infrastructure · Latest · Tier 2 — Notable_

![Nvidia, Amkor Ink $1.5-Billion Deal to Expand US Chip Packaging Capacity — Primary](https://media.assettype.com/outlookbusiness/2026-07-24/a7nelkxn/nvidia_1651928213.webp?w=1200&ar=40%3A21&auto=format%2Ccompress&ogImage=true&mode=crop&enlarge=true&overlay=false&overlay_position=bottom&overlay_width=100)

Amkor Technology has signed a $1.5-billion multi-year agreement with Nvidia to expand advanced semiconductor packaging and testing capacity in the United States. Nvidia will make a prepayment to support the expansion, including new capacity in Arizona, as AI infrastructure demand accelerates. The deal builds on Amkor's existing partnerships with Nvidia, TSMC and AMD to strengthen the US semiconductor supply chain. Following the announcement, Amkor shares rose 17% in extended trading.

## Sources

- [Outlook Business](https://www.outlookbusiness.com/deeptech/nvidia-amkor-ink-15-billion-deal-to-expand-us-chip-packaging-capacity)

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Canonical: https://techandbusiness.org/newswire/A5t082rx4gO7lLfMtZdLXh
Retrieved: 2026-07-24T15:03:12.884Z
Publisher: Tech & Business (techandbusiness.org)