# Nexstrom raises $12 million to scale atomically thin chip materials

_Published Tuesday, September 22, 2026 at 9:08 PM EDT · Capital, Infrastructure · Latest · Tier 2 — Notable_

![Nexstrom raises $12 million to scale atomically thin chip materials — Primary](https://techcrunch.com/wp-content/uploads/2025/05/GettyImages-1366897838.jpg?resize=1200,800)

Singapore semiconductor startup Nexstrom raised a $12 million seed round from Xora Innovation, Foothill Ventures and SEEDS, bringing its total funding to $15 million. The company is developing equipment that grows transition-metal dichalcogenides, materials only a few atomic layers thick, directly on 300mm wafers used by commercial chip factories.

Nexstrom plans to spend the money on process control, measurement, hiring and customer qualification. Its 12-inch system has produced material results, but consistently growing the material across a full wafer remains unresolved, and commercial production is expected between 2030 and 2035.

## Sources

- [TechCrunch](https://techcrunch.com/2026/09/22/singapores-nexstrom-wants-to-bring-2d-semiconductors-to-chip-fabs/)

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Canonical: https://techandbusiness.org/newswire/DYtcGwP945KEYip7HRJ6j-
Published: 2026-09-23T01:08:55.431Z
Story chronology: 2026-09-22T13:20:00.000Z
Retrieved: 2026-09-23T03:23:26.873Z
Publisher: Tech & Business (techandbusiness.org)