# TSMC reportedly considers CoWoS price increase of up to 20%

_Published Tuesday, October 27, 2026 at 11:39 AM EDT · AI, Infrastructure · Latest · Tier 2 — Notable_

![TSMC logo — Primary](https://cdn.mos.cms.futurecdn.net/F7GwETgbWz3VqDaj8UmXcJ-2000-80.jpg)

TSMC is considering raising prices for its CoWoS advanced chip packaging by as much as 20%, Tom's Hardware reports, citing Trendforce's account of supply-chain sources and local media. TSMC has not confirmed the report.

CoWoS combines processor dies and high-bandwidth memory in a single package, supplying the data bandwidth AI accelerators require. More complex chips and longer testing cycles are putting pressure on capacity: Blackwell reportedly takes three to four times longer to test than Hopper.

Equipment delivery times have reportedly stretched from three to six months to as long as eight months, slowing the addition of capacity.

## Sources

- [Tom's Hardware](https://www.tomshardware.com/tech-industry/semiconductors/tsmc-reportedly-weighs-20-percent-cowos-price-increase-as-nvidia-blackwell-and-rubin-chips-put-pressure-on-packaging-capacity-equipment-lead-times-stretch-to-eight-months)

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Canonical: https://techandbusiness.org/newswire/DcUN16HLwGLmUVmiDHQv-k
Published: 2026-10-27T15:39:05.699Z
Story chronology: 2026-10-27T14:30:00.000Z
Retrieved: 2026-10-27T17:40:58.874Z
Publisher: Tech & Business (techandbusiness.org)