SEMI forecasts $227 billion in 300mm fab equipment spending by 2029
Image: Primary Global equipment spending for semiconductor factories that process 300mm wafers will reach $227 billion in 2029, SEMI forecasts, as demand for AI chips and high-performance computing drives manufacturing expansion. Its latest outlook projects equipment investment will rise 31% year over year to $149 billion in 2026, with double-digit growth continuing through 2029.
SEMI expects construction to begin on 20 new fabs or production lines in 2026 and another 18 in 2027, excluding facilities devoted solely to research and development. It forecasts 13 new fabs or lines will begin operations or ship their first silicon in 2026, followed by 23 in 2027.
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