# ASML and chipmakers outline larger-mask High-NA EUV roadmap

_Tuesday, September 8, 2026 at 2:34 AM EDT · Infrastructure · Latest · Tier 1 — Major_

![ASML and chipmakers outline larger-mask High-NA EUV roadmap — Primary](https://startupfortune.com/wp-content/uploads/2026/09/sf-20426-1788849288025.jpg)

ASML and TSMC announced an initiative to move advanced chip production from 6-inch photomasks to a 12-inch format, with Samsung joining the effort, according to the report.

The stated plan calls for a 12-inch mask pilot line by 2031 and 12-inch High-NA EUV systems in advanced-node production by 2033. Samsung is described as targeting High-NA EUV use in DRAM manufacturing from 2028, while TSMC is slated to follow in 2030. Intel has already run more than one million wafers through its High-NA EUV tools, the report said.

## Sources

- [startupfortune.com](https://startupfortune.com/asml-tsmc-samsung-and-intel-agree-on-ai-chip-roadmap-through-2033/)

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Retrieved: 2026-09-08T12:17:53.307Z
Publisher: Tech & Business (techandbusiness.org)