# ASML and chipmakers outline larger-mask High-NA EUV roadmap

_Published Tuesday, September 8, 2026 at 6:17 AM EDT · Infrastructure · Latest · Tier 1 — Major_

![ASML, TSMC, Samsung and Intel Agree on AI Chip Roadmap Through 2033 — Primary](https://startupfortune.com/wp-content/uploads/2026/09/sf-20426-1788849288025.jpg)

ASML and TSMC announced an initiative to move advanced chip production from 6-inch photomasks to a 12-inch format, with Samsung joining the effort, according to the report.

The stated plan calls for a 12-inch mask pilot line by 2031 and 12-inch High-NA EUV systems in advanced-node production by 2033. Samsung is described as targeting High-NA EUV use in DRAM manufacturing from 2028, while TSMC is slated to follow in 2030. Intel has already run more than one million wafers through its High-NA EUV tools, the report said.

## Sources

- [startupfortune.com](https://startupfortune.com/asml-tsmc-samsung-and-intel-agree-on-ai-chip-roadmap-through-2033/)

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Canonical: https://techandbusiness.org/newswire/MXRxmWe1-8Ul5MthSA-BWA
Published: 2026-09-08T10:17:38.328Z
Story chronology: 2026-09-08T06:34:47.000Z
Retrieved: 2026-10-23T16:08:36.040Z
Publisher: Tech & Business (techandbusiness.org)