Samsung reportedly plans to more than double HBM4-family output next year

Samsung Electronics is preparing to more than double production of its HBM4 family of high-bandwidth memory chips next year, Seoul Economic Daily reported, citing semiconductor industry sources and planned glass-carrier cleaning volumes. Outsourced cleaning capacity for the glass supports used while memory wafers are thinned is set to rise from 20,000 to 50,000 sheets a month. The report projects Samsung's total monthly HBM wafer input will increase nearly 40% to about 250,000 wafers, while HBM4 and HBM4E rise from roughly 40% to 80% of the product mix. Glass carriers are reusable, so their volume is an indirect production indicator rather than a unit-for-unit output measure.