# Samsung reportedly plans to more than double HBM4-family output next year

_Published Sunday, September 20, 2026 at 5:20 PM EDT · Products, Infrastructure, AI · Latest · Tier 2 — Notable_

![Samsung to Double HBM4 Output Next Year, Sources Say — Primary](https://wimg.sedaily.com/news/cms/2026/09/20/rcv.YNA.20260318.PYH2026031803840001300_P1.jpg)

Samsung Electronics is preparing to more than double production of its HBM4 family of high-bandwidth memory chips next year, Seoul Economic Daily reported, citing semiconductor industry sources and planned glass-carrier cleaning volumes.

Outsourced cleaning capacity for the glass supports used while memory wafers are thinned is set to rise from 20,000 to 50,000 sheets a month. The report projects Samsung's total monthly HBM wafer input will increase nearly 40% to about 250,000 wafers, while HBM4 and HBM4E rise from roughly 40% to 80% of the product mix. Glass carriers are reusable, so their volume is an indirect production indicator rather than a unit-for-unit output measure.

## Sources

- [en.sedaily.com](https://en.sedaily.com/finance/2026/09/20/samsung-to-double-hbm4-output-next-year-sources-say)

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Canonical: https://techandbusiness.org/newswire/U_K3rR3fmoysS2edW-aK4L
Published: 2026-09-20T21:20:24.730Z
Story chronology: 2026-09-20T07:33:51.000Z
Retrieved: 2026-09-22T01:16:02.276Z
Publisher: Tech & Business (techandbusiness.org)