# Quantum eMotion advances quantum-secure root-of-trust tech with NRC IRAP funding and Taiwan semiconductor collab _Friday, June 26, 2026 at 6:15 PM EDT · science · Latest · Tier 2 — Notable_ ![Quantum eMotion advances quantum-secure root-of-trust tech with NRC IRAP funding and Taiwan semiconductor collab — Primary](https://thequantuminsider.com/wp-content/uploads/2026/03/2026-03-18_13-07.png) Quantum eMotion Corp. is receiving up to 600,000 dollars in non-dilutive funding from the National Research Council of Canada Industrial Research Assistance Program. The funding supports a research and development project focused on quantum-secure semiconductor technology in collaboration with Taiwan-based JMEM Tek. The joint R&D project represents more than 2.5 million dollars in combined development investment. It focuses on the development of a secure System-on-Chip platform that integrates quantum-grade entropy generation, hardware-based cryptographic acceleration, silicon-level Root of Trust, and Physically Unclonable Function technology. The secure SoC platform is being designed for deployment across AI data centers, cloud infrastructure, financial platforms, defense systems, healthcare networks, and critical infrastructure environments. It aims to provide hardware-level protection against tampering, cloning, and quantum-enabled threats. Chief Executive Officer Francis Bellido said the NRC IRAP support is a significant milestone. He said the collaboration with JMEM Tek combines quantum entropy, PUF-based device identity, and hardware Root-of-Trust architecture to advance secure semiconductor innovation. ## Sources - [The Quantum Insider](https://thequantuminsider.com/2026/03/18/quantum-emotion-advances-quantum-secure-root-trust-technology-taiwan-semiconductor-firm/) - [Infleqtion](https://infleqtion.com/infleqtion-selected-to-receive-3-9m-in-federal-funding-for-technology-to-harness-quantum-computing-for-next-generation-innovation-in-chemistry-and-materials-science/) --- Canonical: https://techandbusiness.org/newswire/X0O85GNlLhBSz1ObTpCevf Retrieved: 2026-06-27T04:15:34.948Z Publisher: Tech & Business (techandbusiness.org)