Siemens launches Fuse EDA AI Agent for automation across semiconductor, 3D IC and PCB system workflows

Siemens announced the Fuse EDA AI Agent system. The purpose-built domain-scoped autonomous AI agent plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and printed circuit board system workflows that span design, verification and manufacturing sign-off. Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the system manages workflows across Siemens EDA portfolio. It delivers automation that accelerates engineering productivity and achieves higher-quality designs. The agent builds upon the Fuse EDA AI system, which features a sophisticated RAG pipeline, a multimodal EDA-specific data lake, specialized parsers for EDA file formats, customizable access controls, support for multiple AI models and an open approach for third-party integrations. Fuse EDA AI Agent provides end-to-end automation across the full design lifecycle. In front-end design and verification stages, it supports automation of architectural exploration, design planning and register-transfer level coding with Catapult software. It also assists with testbench generation and debugging through integration with the Questa One Agentic Toolkit. As designs move to physical implementation, the agent assists with place-and-route, timing closure and power optimization through Aprisa software. It accelerates custom design and verification with Solido software along with hardware-assisted verification with the Veloce system. Fuse EDA AI Agent accelerates physical verification sign-off Amit Gupta, chief AI strategy officer, senior vice president and general manager of Siemens EDA at Siemens Digital Industries Software, said the Fuse EDA AI Agent represents the next evolution of the Fuse EDA AI system. It moves from in-tool AI capabilities to autonomous, end-to-end workflow orchestration. The system provides domain-specific expertise, scalable AgentOps and MCP architecture, enterprise infrastructure and data orchestration and embedded security and governance. Jung Yun Choi, executive vice president of Memory Design Technology at Samsung Electronics, said Samsung is pleased to introduce Siemens Fuse as a key enabler for cutting-edge design strategies within its agentic semiconductor workflows.