# Samsung outlines HBM roadmap that moves compute closer to memory

_Published Tuesday, September 1, 2026 at 8:07 AM EDT · Infrastructure, AI · Latest · Tier 2 — Notable_

![Samsung HBM4 — Primary](https://cdn.mos.cms.futurecdn.net/uSsEaP6EeszzwUBwgzoM47-1727-80.jpg)

Samsung outlined a three-phase high-bandwidth-memory roadmap at Hot Chips 2026 that would move more functions into the HBM base die and ultimately place a processor beneath stacked DRAM in a proposed 3D design called zHBM.

Samsung said HBM4's 4nm logic base die is the starting point. Its proposed custom HBM design would move memory controllers from an accelerator to the base die, while later phases add telemetry, expansion and selected processing. Samsung provided no firm launch dates for the roadmap phases.

## Sources

- [Tom's Hardware](https://www.tomshardware.com/tech-industry/semiconductors/hot-chips-2026-samsung-reveals-a-three-phase-hbm-roadmap-that-puts-logic-and-compute-inside-memory-zhbm-ultimately-stacks-dram-directly-on-top-of-the-processor)

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Canonical: https://techandbusiness.org/newswire/gpIV_VpXxHLYX5zFRLTCbU
Published: 2026-09-01T12:07:10.222Z
Story chronology: 2026-09-01T11:06:15.000Z
Retrieved: 2026-10-16T21:02:45.656Z
Publisher: Tech & Business (techandbusiness.org)