# Malaysia's SQ Advanced Interconnect considers $73 million IPO

_Published Wednesday, October 7, 2026 at 10:39 PM EDT · Products, Infrastructure · Latest · Tier 2 — Notable_

Malaysian semiconductor firm SQ Advanced Interconnect Bhd. is considering raising about 300 million ringgit ($73 million) through an initial public offering, Bloomberg reported, citing people familiar with the matter. The contemplated offering would take place in the first quarter of 2027.

## Sources

- [Bloomberg Technology](https://www.bloomberg.com/news/articles/2026-10-08/malaysian-chip-firm-sqai-said-to-plan-73-million-ipo-in-early-2027)

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Canonical: https://techandbusiness.org/newswire/j9E9qohl1-7QqJVtm1cegp
Published: 2026-10-08T02:39:47.772Z
Story chronology: 2026-10-08T01:36:51.000Z
Retrieved: 2026-10-08T04:43:53.511Z
Publisher: Tech & Business (techandbusiness.org)