# SK hynix begins Indiana HBM packaging project

_Friday, August 28, 2026 at 5:58 AM EDT · Infrastructure · Latest · Tier 1 — Major_

![SK hynix begins Indiana HBM packaging project — Primary](https://cdn.mos.cms.futurecdn.net/vdguSryvDxvr9spm9qGncn-1600-80.jpg)

SK hynix held a groundbreaking ceremony for a high-bandwidth-memory production base in West Lafayette, Indiana. The company plans a facility for advanced packaging, testing and R&D, with a cleanroom expected by October 2028 and volume production of next-generation HBM targeted for the second half of 2029.

SK hynix puts the cost at about $4 billion and expects about 1,000 employees once commercial operations begin. The site will package stacks from DRAM wafers made in South Korea and base dies made in South Korea, Taiwan or the United States.

## Sources

- [Tom's Hardware](https://www.tomshardware.com/pc-components/dram/sk-hynix-breaks-ground-on-the-first-hbm-plant-in-the-us-bringing-key-ai-component-production-to-the-states-says-production-starts-in-2029)

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Canonical: https://techandbusiness.org/newswire/rg4y_fsU4N485mUnbCUA4-
Retrieved: 2026-08-28T12:41:24.926Z
Publisher: Tech & Business (techandbusiness.org)