# SK hynix pushes hybrid-bonded HBM beyond HBM4E

_Published Monday, August 24, 2026 at 3:08 PM EDT · AI · Latest · Tier 2 — Notable_

![SK Hynix Hot Chips 2026 iHBM — Primary](https://cdn.mos.cms.futurecdn.net/9DnrtFAiRKUUZvGY424ZgZ-2560-80.jpg)

SK hynix said at an Aug. 23 Hot Chips presentation that it does not expect hybrid bonding to be ready for HBM4E, leaving HBM5 as its earliest possible use.

The company said 16-high HBM4 is in customer qualification at 48GB per cube while 12-high is in mass production. It cited a 775-micron package-thickness ceiling and shrinking die gaps as manufacturing and thermal constraints. SK hynix said its iHBM cooling blocks require customer co-design and cannot be added to generations already in design.

## Sources

- [Tom's Hardware](https://www.tomshardware.com/tech-industry/semiconductors/sk-hynix-says-hybrid-bonding-wont-be-ready-for-hbm4e-as-ai-memory-runs-into-a-775-micron-ceiling)

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Canonical: https://techandbusiness.org/newswire/rjr-kquDvv2snloxFs9v52
Published: 2026-08-24T19:08:02.195Z
Story chronology: 2026-08-23T00:00:00.000Z
Retrieved: 2026-10-09T05:27:14.837Z
Publisher: Tech & Business (techandbusiness.org)