# MIT demonstrates wafer-scale flexible transparent photonic chips

_Thursday, September 3, 2026 at 11:45 AM EDT · Science · Latest · Tier 2 — Notable_

![MIT demonstrates wafer-scale flexible transparent photonic chips — Primary](https://news.mit.edu/sites/default/files/images/202609/MIT-FlexibilePhotonics-01-press.jpg)

MIT researchers and engineers at NY Creates developed a fabrication process for flexible, transparent silicon-photonics chips on 300-millimeter wafers.

The process uses standard semiconductor manufacturing methods, removes the original silicon substrate and leaves ultrathin optical layers on transparent polyester film. In tests, a chip was bent thousands of times around cylinders as narrow as a small screw without a performance drop, and transparency testing found minimal haze or image distortion.

The work, published in Optica, advances a platform beyond earlier few-device demonstrations.

## Sources

- [MIT News](https://news.mit.edu/2026/fabrication-platform-could-enable-flexible-transparent-next-generation-photonic-chips-0903)

---
Canonical: https://techandbusiness.org/newswire/vr5dfBjI9OVLGZKzqTjRpr
Retrieved: 2026-09-04T00:46:08.435Z
Publisher: Tech & Business (techandbusiness.org)