# TSMC works on new advanced chip packaging similar to Intel: report

_Thursday, July 30, 2026 at 8:00 AM EDT · Infrastructure · Latest · Tier 2 — Notable_

![TSMC works on new advanced chip packaging similar to Intel: report — Primary](https://cdn.benzinga.com/cdn-cgi/image/width=1200,height=800,fit=crop/files/images/story/2026/07/31/Hsinchu--Taiwan---Apr-12--2021-Tsmc-Muse.jpg)

TSMC is developing a chip packaging technology similar to Intel's Embedded Multi-die Interconnect Bridge, internally called "EMIB Like," and is partnering with Taiwan's Kinsus Interconnect Technology on the project, The Information reported Thursday.

The report also said Nvidia is evaluating Intel's EMIB packaging technology for a future processor. TSMC, Intel and Nvidia did not immediately respond to Benzinga's requests for comment.

Intel has positioned EMIB as an advanced packaging technology that uses silicon bridges to connect multiple chip components, enabling larger, more complex processors while improving efficiency and reducing manufacturing costs. The report comes days after Intel announced a strategic partnership with China's Lens Technology to develop glass substrate-based advanced semiconductor packaging for future AI and data center chips.

## Sources

- [benzinga.com](https://www.benzinga.com/markets/tech/26/07/60829355/tsmc-is-reportedly-developing-advanced-chip-packaging-tech-to-challenge-intels-dominance)

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