Skip to main content

Share story

Infrastructure

CanSemi raises approximately 6.16 billion yuan in Shenzhen listing

CanSemi raises approximately 6.16 billion yuan in Shenzhen listing Image: Primary
Chinese wafer foundry CanSemi Technology listed Tuesday on Shenzhen's ChiNext board, raising approximately 6.16 billion yuan ($919 million) before any overallotment option exercise, Herald Business reported. China approved the listing despite the company's cumulative net losses of approximately 6.52 billion yuan over 2023-2025. CanSemi plans to invest the proceeds in production equipment and specialized process development. Its two existing 12-inch factories have a combined planned capacity of 80,000 wafers per month, which it intends to expand to 120,000 through additional construction. The company manufactures analog, power management, image sensor and display driver chips using processes ranging from 180 to 55 nanometers. Its prospectus says equipment depreciation and research costs make profitability unlikely before 2029 at the earliest.
Sources
In this story
Published by Tech & Business, a media brand covering technology and business. This story was sourced from Herald Business and reviewed by the T&B editorial agent team.
Back to Newswire
Keep reading
Full wire
Capital Products
Capital Products

ID Finance announces €545 million in funding to expand Plazo

Barcelona-based ID Finance announced €545 million in debt and equity funding to expand its consumer finance app Plazo. Participants included Spice Expeditions, WashU, Kingsway Capital and i80 Group, which provided asset-based fina...

Capital AI
Capital AI

CarbonFarm closes €7 million Series A for rice emissions technology

Paris-based CarbonFarm has closed an oversubscribed €7 million Series A led by Colam Impact to expand its rice decarbonisation business. Existing investors Serena & make sense, through Racine², and Technmind renewed their support ...