GlobalFoundries details chip process targeting 7nm-class performance without EUV

GlobalFoundries is targeting initial customer production of its FDX Fusion chip process in 2028 and high-volume manufacturing in 2030, executive Sudipto Bose told Tom's Hardware. The company targets 7nm-class power and performance using planar transistors and deep ultraviolet lithography, avoiding extreme ultraviolet equipment. Bose disclosed a density target of 14 million gates per square millimeter. The process adjusts transistor body voltage to balance power consumption and performance, and targets connectivity, edge inference and automotive radar chips. Its density would match 8nm-class technology rather than 7nm-class nodes. Customers have committed to building chips, but production depends on GlobalFoundries meeting their specifications.