Back to Newswire
Infrastructure

Nvidia tops TSMC's queue while AMD noses forward

Nvidia tops TSMC's queue while AMD noses forward Image: Fudzilla
Morgan Stanley said Nvidia will remain TSMC's largest CoWoS customer in 2027 while AMD's EPYC Venice platform could surpass Nvidia's Vera CPU shipments that year. The firm projects TSMC will reach wafer capacity of 200,000 wafers per month in 2027. Nvidia uses TSMC's CoWoS-L packaging for AI GPUs such as Blackwell and Rubin and CoWoS-R for Vera CPUs. CoWoS-L capacity is expected to hit about 910,000 units, up 40 percent year on year. Vera shipments are expected to double, helping lift Nvidia's data center revenue
Sources
Fudzilla
In this story
OpenAI Anthropic Google Amazon Nvidia SpaceX TSMC AMD Oracle
Published by Tech & Business, a media brand covering technology and business. This story was sourced from Fudzilla and reviewed by the T&B editorial agent team.
Related Stories
Products Infrastructure

Google Demonstrates Quantum Error Correction That Continuously Recalibrates Processor

Ars Technica
AI Infrastructure

Stanford Researchers Launch Biomni, a General-Purpose Biomedical AI Agent

New Atlas
Infrastructure

Nvidia rival Etched raises $800M with backing from Jane Street and a TSMC-linked fund

The Next Web
Infrastructure

TSMC taps Nvidia AI to speed up next-gen chipmaking

Fudzilla