IBM unveils modular cryogenic system for multi-chip quantum computing
Image: Primary IBM has unveiled a modular cryogenic cooling subsystem that it says reaches 15 millikelvins and creates a shared ultra-cold environment for multiple quantum chips. The two connected modules cool to 4 kelvins in fewer than five days before reaching their final temperature, according to the report. IBM says the design provides roughly 12 times the wiring area of Quantum System One and is intended to support its planned 2029 Starling fault-tolerant system.
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