Kulicke & Soffa Expands Memory Solutions Portfolio

Kulicke and Soffa Industries, Inc. announced an expanded portfolio of memory focused interconnect solutions. The portfolio reinforces the company's leadership across Ball, Vertical Wire, Advanced Thermo Compression and Hybrid Bonding technologies. The company introduced the ProMEM suite of memory focused process enhancements for Ball Bonding. The suite spans first bond, second bond, bumping and looping processes. Combined, the capabilities enable up to 20 percent higher throughput while improving bond quality for advanced memory packaging applications. Vertical Wire innovations deployed on the ATP MEM PLUS and Ball Bonder platforms increase interconnect density in stacked memory designs. The approach reduces package footprint and supports stacked DRAM and other memory formats in high volume production. The APTURA platform now supports advanced memory applications with fluxless Thermo Compression capabilities. These features include positioning accuracy and oxide reduction options that enable near zero die gap heights and low resistance direct copper to copper interconnects. The company anticipates its TCB business will grow approximately 70 percent sequentially in fiscal year 2026. Kulicke and Soffa has accelerated its Hybrid Bonding development program since 2024. The Ball Bonding, Vertical Wire, Advanced Thermo Compression and Hybrid Bonding solutions form a cohesive memory interconnect roadmap.