Researchers show audio-visual models can discard tokens after transferring their information
Researchers report that audio-visual language models can discard input tokens after transferring their information into the language model, with minimal impact on predictions or slight improvements.
Nvidia releases Dynamo deployment recipes for four Korean open models
Nvidia is releasing deployment recipes for four Korean open models: SK Telecom's A.X K2, LG AI Research's K-EXAONE 2.0, Upstage's Solar Open 2 and Motif Technologies' Motif-3.
WorldParticle demonstrates one AI architecture for six physical simulation tasks
Researchers at MIT, the University of British Columbia and other institutions demonstrated an AI architecture that modeled six physical phenomena, including deformable objects, granular materials and proteins.
InTest reports record $49.4 million in orders as semiconductor demand grows
InTest reported record third-quarter orders of $49.4 million, up 31% from a year earlier, with semiconductor orders totaling $25.1 million, according to an earnings-call account published by The Globe and Mail.
CISA flags SonicOS flaw that can bypass SAML-enforced MFA
CISA has added SonicWall SonicOS vulnerability CVE-2026-19868 to its Known Exploited Vulnerabilities catalog following reports of possible exploitation.
Samsung reports faster chip simulations using AI and Nvidia GPUs
Samsung achieved a roughly 1,600x speedup in one chip engineering simulation by combining AI-predicted material properties, coarser computational grids and Nvidia GPU acceleration, Nvidia said.