OKI Launches EMS for AI Server Equipment Featuring Proprietary High Heat Dissipation Technology

OKI will launch comprehensive electronics manufacturing services for AI server equipment on March 25, 2026. The services cover the design and production of large-size multi-layer printed circuit boards that use the company's proprietary high heat dissipation technology for high-speed and high-capacity data transmission. They also include component procurement, PCB component mounting, system assembly, testing, and reworking. OKI targets AI server equipment manufacturers with these offerings. The company aims for sales of JPY 1 billion in fiscal 2026. OKI developed the capabilities through manufacturing semiconductor testing equipment and information and communications infrastructure equipment. The services feature high-density mounting technology for AI semiconductors along with simulation and manufacturing for multi-layer PCBs that incorporate embedded copper coin technology. OKI also provides high-speed X-ray solder inspection, automated functional testing, and high-mix low-volume production. These elements support high yields and shorter production lead times. On the reworking side, OKI uses a dedicated line that combines proprietary jigs and handwork by skilled technicians. The approach handles AI semiconductors with over 10,000 pins through advanced soldering techniques. Customers can expect improved yields, reduced failure costs, shorter delivery times, and gains in management efficiency.