MediaTek Analyst Day outlines data center ASIC push for AI

MediaTek used its 2026 Analyst Day to present its data center strategy as the company transitions from a mobile-first consumer chip supplier to a business partner for cloud providers and enterprises. The data center segment was named the highest priority and largest growth opportunity with a revenue target of one billion dollars for 2026. MediaTek is positioning itself against custom silicon suppliers Broadcom and Marvell The company is investing in 224G and 448G SerDes technology along with near-package copper and co-packaged copper interconnects to support AI network requirements. Advanced packaging work includes designs that exceed standard reticle limits with 3.5D packages that integrate 10,000 to 20,000 square millimeters of silicon. Integrated voltage regulators are being applied to reduce power delivery network noise and improve efficiency based on methods developed for mobile chips. Memory efforts center on custom high-bandwidth memory at 16 Gbps and adaptations of low-power double data rate memory that incorporate reliability features for data center use. MediaTek is applying design technology co-optimization with TSMC to gain performance advantages from current process nodes. The company is developing mesh and point-to-point co-packaged optics along with native NVLink support. It has also produced MicroLED active optical cables through work with Microsoft. MediaTek maintains multi-foundry ties with both TSMC and Intel to back its data center ASIC development.