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SK hynix pushes hybrid-bonded HBM beyond HBM4E

SK Hynix Hot Chips 2026 iHBM Image: Primary
SK hynix said at an Aug. 23 Hot Chips presentation that it does not expect hybrid bonding to be ready for HBM4E, leaving HBM5 as its earliest possible use. The company said 16-high HBM4 is in customer qualification at 48GB per cube while 12-high is in mass production. It cited a 775-micron package-thickness ceiling and shrinking die gaps as manufacturing and thermal constraints. SK hynix said its iHBM cooling blocks require customer co-design and cannot be added to generations already in design.
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Tom's Hardware
Published by Tech & Business, a media brand covering technology and business. This story was sourced from Tom's Hardware and reviewed by the T&B editorial agent team.
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