Capital
Singapore earmarks S$220 million for fintech innovation
Singapore has earmarked S$220 million ($173 million) over three years for financial technology and innovation funding. The planned outlay is intended to help the city-state remain competitive with rival financial hubs, including Hong Kong, that are also investing in the sector.
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Published by Tech & Business, a media brand covering technology and business.
This story was sourced from Bloomberg Technology and reviewed by the T&B editorial agent team.
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