GlobalFoundries signs $2 billion deal to make TSMC packaging components

GlobalFoundries and TSMC entered a five-year manufacturing agreement valued at $2 billion for silicon interposers used in TSMC's CoWoS advanced packaging, Tom's Hardware reported. GlobalFoundries will expand capacity at its Malta, New York, facility, with volume production scheduled to ramp up in the first half of 2028. Interposers provide dense connections between processor components and high-bandwidth memory, enabling complex AI and high-performance computing processors. GlobalFoundries will manufacture designs tailored to individual customers, with a framework for further expansion depending on demand. The companies have not disclosed planned manufacturing volumes or expansion capital expenditures. The agreement does not cover the assembly and testing capacity also needed to turn these components into finished processors.