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Lightspring raises €3.1 million to industrialize photonic-chip packaging

Lightspring raises €3.1 million to industrialize photonic-chip packaging Image: Primary
Lightspring closed a €3.1 million seed round led by Atlantic and OVNI Capital to move its optical-coupling process from the laboratory to a production line. Concept Ventures, Ixcore, Plug and Play Ventures and business angels participated. A €350k grant and other public funding bring its total dilutive and non-dilutive financing to over €3.5 million. The French startup uses two-photon 3D lithography to fabricate microlenses, waveguides and other coupling structures directly on photonic chips. It targets losses below 0.5 dB per interface without active alignment, compared with the 2-3 dB typical loss the company cites for current methods. Industrial qualification remains ahead.
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Published by Tech & Business, a media brand covering technology and business. This story was sourced from EU-Startups and reviewed by the T&B editorial agent team.
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