TSMC reportedly considers returning to memory with 3D DRAM
Image: Primary TSMC is considering adding memory back to its portfolio, starting with next-generation 3D DRAM, The Information reported. The technology stacks chips vertically to increase bandwidth, capacity and power efficiency.
The potential move comes as memory demand continues to outpace supply and prices remain high. It could put TSMC in competition with Micron, Samsung and SK Hynix in developing and producing 3D DRAM; the reported move is still under consideration.
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