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Sonos opens its platform to third-party AI assistants

Bloomberg reported that Sonos has opened its platform to third-party AI assistants, upgraded its Sonos voice assistant with an in-house LLM, and plans to let users create their own AI agents. The company is repositioning its software platform beyond speaker control. The report does not give a timetable, product scope, or terms for third-party access.
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Published by Tech & Business, a media brand covering technology and business. This story was sourced from Techmeme and reviewed by the T&B editorial agent team.
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AI Products
AI Products

Lambda reportedly raises $1 billion in private debt for Nvidia GPUs

Cloud provider Lambda has reportedly secured $1 billion in short-term private debt to buy Nvidia GPUs, according to Bloomberg reporting cited by Data Center Dynamics. The company is expected to lease the chips to Microsoft under t...

AI
AI

AWS makes Claude Fable 5.1 available through Bedrock

AWS said Claude Fable 5.1 is available today through Amazon Bedrock and Claude Platform on AWS, including US Geo and Global inference profiles. AWS describes the model as suited to coding, scientific research and enterprise workfl...

Security AI
Security AI

Langflow flaw is being exploited to harvest cloud and AI credentials

Threat actors are exploiting CVE-2026-0768, an unauthenticated remote-code-execution flaw in Langflow's custom-component code validator, to steal credentials, tokens and keys, according to VulnCheck observations reported by Bleepi...

Capital
Capital

HiBob funding round values HR software company above $3.2 billion

Salesforce is investing in HR software company HiBob in a $160 million funding round that values the startup at more than $3.2 billion, according to people familiar with the matter. The investment gives HiBob new capital alongside...

Infrastructure Policy
Infrastructure Policy

India notifies Semicon 2.0 incentives for chip supply chain

India's Ministry of Electronics and Information Technology has notified Semicon 2.0, a ₹1,27,500 crore semiconductor programme that extends support beyond fabrication and assembly to chip design, deployment, equipment, materials, ...