ASIP Begins Work on ₹2,500 Crore Semiconductor OSAT Facility in Visakhapatnam

Prime Minister Narendra Modi virtually laid the foundation stone for ASIP Technologies' 2,500 crore rupee semiconductor manufacturing facility in Visakhapatnam recently, marking the launch of Andhra Pradesh's and South India's first semiconductor manufacturing project approved under the India Semiconductor Mission, officials said. The Outsourced Semiconductor Assembly and Test facility, coming up on a 30-acre site at Tarluvada, is expected to strengthen India's semiconductor packaging ecosystem while supporting sectors such as artificial intelligence, high-performance computing, data centres and high-speed communications. Andhra Pradesh Chief Minister N. Chandrababu Naidu joined the Prime Minister virtually during the foundation stone ceremony. ASIP said the project is being developed in partnership with South Korea's APACT Co., which will serve as the technology partner. The facility will begin with an initial investment of more than 460 crore rupees and is planned to be expanded through an additional investment of over 2,000 crore rupees. Once operational, the plant will have an annual production capacity of 96 million semiconductor chips. The project is expected to generate more than 1,000 direct high-skilled jobs and 1,600 indirect jobs. Venkata Simhadri, Managing Director and CEO of ASIP Technologies, said the facility represents an important milestone in the company's efforts to build advanced semiconductor packaging and testing capabilities in India.