TSMC weighs 10%-20% increase in advanced chip packaging prices

TSMC is considering raising advanced chip packaging prices by 10%-20% as AI demand strains capacity, China Times reported, citing supply-chain sources. The potential increase would affect CoWoS, a process that combines chips and high-bandwidth memory in a single package, and could raise costs for Nvidia and AMD. Demand is expanding beyond graphics processors to server CPUs and custom AI chips. The report expects monthly CoWoS capacity to exceed 130,000 units in 2026 and 200,000 units next year; the price increase remains under consideration.